ICPT2014ICPT2014

Attention!: This site is not for ICPT2014 (Int'l Conf. on Positioning Technology)

News

Jan 29, 2015 Group Photo is uploaded.
Jan 29, 2015 ICPT2014 contents is now available online.
Nov 12, 2014 Time Table and Final Program is uploaded.
Nov 04, 2014 Draft Program is revised.
Oct 22, 2014 Draft Program is uploaded.
Oct 01, 2014 Invited Speakers are uploaded.
Sept 17, 2014 Deadline of Advance Registration is extended to Sept 30, 2014
July 10, 2014 Registration and Accommodation is uploaded.
May 15, 2014 Abstract due date is extended.
Mar 27, 2014 Sponsors and Exhibition is updated.
Mar 20, 2014 Abstract Template is uploaded.
Feb 27, 2014 Call for Papers is updated.
Dec 11, 2013 Official website is opened

Important Dates

Abstract Due Date
May 15, 2014 May 30, 2014

Acceptance Notification
July 15, 2014 July 24, 2014

Final Paper Due Date
September 30, 2014

ICPT2014 International Conference on Planarization/CMP Tecnology ICPT 2014 Kobe Japan November 19-21, 2014

Venue

Kobe International Conference Center, Kobe, Japan


Organized by

ICPT2014 Organizing Committee, the Planarization and CMP Technical Committee, JSPE
CMP LOGO

In corporation with

Korea CMP User Group (KCMPUG)
Northern California Chapter AVS (NCCAVS) CMPUG
Europe CMP User Group (ECMPUG)
Chemical Mechanical Planarization User Group Taiwan (CMPUGTW)
Chinese Technical Committee of Tribology in Micro/Nano Manufacturing (CTI-CMPUG)


Technically cosponsored by

IEEE EDS
IEEE LOGO

Supported by

The Japan Society for Precision Engineering (JSPE)
The Japan Society for Abrasive Technology (JSAT)
SEMI Japan
Japan Optomechatronics Association (JOEM)
Japan Society for the Promotion of Science, the 136th committee
Japan Society for the Promotion of Science, the 145th committee
Kobe city


Invitation

Dear Colleagues,
The first international symposium for Planarization/CMP Technology was held at PacRim2004 in Tokyo, Japan. The 11th ICPT2014 will be held in Kobe, Japan on November 19-21, 2014. This will be the third time here in Japan since the first time, at PacRim2004 in Tokyo and the second, at ICPT2009 in Fukuoka.
Last year we had celebrated the 10th anniversary of ICPT conference in Hsinchu, Taiwan. This ICPT2014 will mark the beginning of a new chapter for the next decade.
CMP, one of the most important processes in the semiconductor devices manufacturing, has been developed and improved continuously year after year, has built a certain position in related industries, and is expanding in its applied area. From the user's point of view, technical demand is becoming higher and higher, and additional applications beyond the semiconductor area are increasing.
ICPT as an international symposium for Planarization/CMP is a magnificent opportunity to have discussions on technologies including FEOL and BEOL CMP, 3D/TSV, Fundamentals of CMP, Polishing Processes, Consumables, Equipment, Green Devices, New Applications, Metrology, Cleaning, Defect Control, Process Control, CMP Alternatives, SiC, GaN, Sapphire and Diamond. The conference provides a place where every relevant researcher and engineer can get together to discuss openly and exchange information widely. Enthusiastic presentations and discussions are expected to be on an equal footing, flat like the surface of wafer, no matter what country, organization/position and technology area he/she belongs to.
The city of Kobe, one of three major passenger port towns in Japan, has many buildings with western-style architecture, a townscape and an exotic mood. Kobe is a fascinating city even for Japanese people.
Japan will welcome you all with the heart of "O・Mo・Te・Na・Shi" (expecting nothing in return), hospitality, reception, and entertainment services from our heart, as sensitive and smooth as the semiconductor rule.
ICPT2014 Conference Chair,
Signature
Hirokuni Hiyama
Director, Ebara Corporation